Jul. 29, 2024
C. Easy to achieve small dot pitch, from the physical space size, COB package in the design of lamp bead diameter is no longer limited by the size of the bracket, the current technology can be designed to 1.2mm lamp bead diameter, the safe distance between the lamp bead and the lamp bead can reach 0.5mm.
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Theoretically small point pitch can achieve P1.7 level. In the future, with the advancement of led chip technology, the size will be further reduced, or with the emergence of flip-chip led, the breakthrough of P1.0 level is not far away.
D. Ultra-thin and light: According to the actual needs of customers, the thickness of the PCB board from 0.4-1.2mm, so that the weight is reduced to at least 1/3 of the original traditional products, which can significantly reduce the structure, transportation, and engineering costs for customers.
E. Anti-collision and anti-pressure: COB products are directly encapsulated with led chips in the concave position of the PCB board, and then cured with epoxy resin, the surface of the light point is raised into a spherical surface, smooth and hard, resistant to impact and abrasion.
F. Large viewing angle: Traditional led display, first, the led chip in the bottom of the lamp cup, and the cup between the formation of a certain drop, followed by the encapsulated light in the process of SMD position accuracy error, and again the lock mask unevenness and other three reasons, resulting in a lower viewing angle and viewing angle unevenness. The COB package adopts shallow well spherical luminescence, the viewing angle is greater than 175 degrees, close to 180 degrees, and has a better optical diffuse color turbid light effect than SMD.
G. Bendable: Bendability is a unique feature of COB package, the bending of PCB will not cause damage to the packaged LED chip, while the bending of SMD PCB may cause the desoldering of the chip pin. Therefore, the use of COB module can easily make led curved screen, round screen, wave-shaped screen. It is the ideal substrate for bars and nightclubs personalized modeling screen.
Can do no gap splicing, production structure is simple, and the price is much lower than the flexible circuit board and traditional display module made of led shaped screen. High density P4 series module cylindrical bending ability can reach 50cm in diameter, which is the ideal substrate for cylindrical media selection in airports, stations, and shopping malls.
H. Strong heat dissipation ability: SMD and DIP products mainly through the gel, lamp leg or pad heat dissipation, heat dissipation area is small, heat will be more concentrated in the chip, a long time will cause serious light attenuation phenomenon, and even dead light phenomenon, reducing the service life and quality of the display.
And COB products are packaged on the PCB board of the lamp, through the PCB board of the copper foil quickly the heat of the wick out, and the thickness of our PCB board copper foil are strict process requirements, coupled with the sink gold process, the PCB board price is SMD and DIP the same specifications of two times. Thats why our COB products are hotter to touch. Touching them is very hot, which means that the heat is easily dissipated and hardly causes serious light attenuation. So, it rarely dies, which greatly extends the life of led display.
I. High stability: High reliability is reflected in the fact that the bad dot rate of the module has always been controlled at <5/, much higher than the national standard. We have the following points to ensure that it is not difficult to achieve this standard, or even better.
a). Production process: the traditional led display process is more numerous, especially in the process of reflow soldering, high temperature state SMD lamp bead stent and epoxy resin expansion coefficient is not the same, very easy to cause the stent and epoxy resin encapsulation shell off, gaps, in the later use of the gradual emergence of dead light phenomenon, resulting in a high rate of bad.
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The reason why COB technology display is more stable is because there is no reflow solder paste lamp in the processing process, even if there is a later reflow solder paste IC process, the diode chip has been protected with epoxy resin encapsulation curing, it avoids the problem of gaps between the lamp bead holder and epoxy resin caused by high temperature soldering in the welding machine, so our COB products are not easy to appear after the factory dead light phenomenon.
b). Use of high-end manufacturing equipment: we use the most advanced ASMs automatic welding equipment at present.
c). Strict quality control of the whole process.
d). Business philosophy: we use advanced production process to reduce the cost to provide customers with the best quality raw materials, for example, our PCB board using the sunken gold process, the price is twice as much as the same size of traditional modules. Usually, we use bigger chips and better ICs, and in the structure, we use better heat dissipation materials.
J. Six anti advantages: Waterproof, moisture-proof, dust-proof, anti-static, anti-oxidation, anti-UV. The traditional led display pin pads are exposed, in case of water or moisture, it is easy to short-circuit between the pads; the use of uneven mask, it is difficult to clean up when stained with dust; the use of alloy wire and iron bracket is easy to be oxidized; the exposed pin pads are easily affected by static electricity, the phenomenon of dead lights.
COB is the chip with epoxy resin protection, no exposed feet, can play a waterproof, dustproof, anti-static and other functions. When in contact with water, a wipe with a cloth is good. The outdoor module, which is not afraid of water at all, has no effect on the screen body. After a period of use, the dust of the screen body can be wiped directly with a cloth, and the dust is cleaned directly from the smooth surface.
The module adopts the circuit board of sink gold process and special treatment process, which can resist oxidation and ultraviolet rays, and can work normally at a low temperature of minus 30 degrees and a high temperature of minus 80 degrees.
K. Energy-saving high brightness: The current SMD competition is fierce, the general use of small chips of led surface mount lights, the normal use of the light load is high, the brightness cannot come up, the brightness decay coefficient is large, after a period, the consistency will become significantly worse. COB products using large chips of light-emitting diodes, can effectively improve the brightness, and uniform heat dissipation, brightness attenuation coefficient is smaller, after a long-time use can also ensure a better consistency. And under the premise of emitting the same brightness, COB heat is smaller and more energy efficient.
COB outdoor high density and high brightness full color range, product cost performance and traditional products have absolute advantages compared to the same time in the indoor and outdoor led shaped screen, creative modeling screen has a unique advantage, in the indoor display project module can beat the dot matrix module unit board, in the indoor full color screen has the advantage of beyond SMD quality. In indoor and outdoor ultra-thin and ultra-thin double-sided screen has absolute advantages.
In the field of outdoor display, P20-P10 market is still the world of DIP, but the market share is gradually shrinking due to the obsolete product technology, P8-P6 will be the mainstream development market. The world is divided by SMD and COB. In outdoor P5-P4 high density and high brightness full color market will be dominated by COB. In the indoor screen full-color low-end, SMD occupies a place.
Currently, because of fierce competition, SMD is likely to have the same home as dot matrix module. In the indoor high-end small pitch, COB products will have the absolute advantage. In indoor and outdoor shaped screens and creative shaped screens, COB products have an absolute advantage.
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